As the application range of a flip chip is widened to mobile devices, the size of a flip chip is miniaturized, and then the bump height tends to become lower. When a small flip chip is mounted on a board, a dispenser should highly precisely dispense a minute amount underfill adhesive agent to fill the agent under the chip in high-density.

Applicable product: X-JET Piezojet dispenser

This X-JET Piezojet dispenser can impregnate the clearance under a chip with underfill agent by dispensing a minute drop of the agent without contacting the chip. Its high-speed dispensing whose maximum discharge cycle reaches 500 Hz reduces the tact time.

Dispensing of an underfill agent