Fine patterning on a wafer or at a level of chips
Coloring of an emblem, dispensing of FIPG, grease, and so on
Underfilling, dispensing solder paste
Dot jetting/paining without masking
Direct dispensing of solder to a micro part
Forming of a miniaturized electronic circuit with conductive paste
Dispensing of UV adhesive and curing at the same time
Dispensing of a shading agent to the panel end face from the side
Dropping microvolume reagent/enzymes to fill a micro channel
