Our product can coat (paint out) the entire surface of a wafer with a liquid agent such as polyimide or high-viscosity resist. Because it can dispense the required amount to the target position, the amount of the used material can be reduced significantly by comparing with a spin coater. It also dispenses to the circumference of a wafer.

It can dispense to dies, so that it is best suited to the dispensing process of manufacturing of parts such as power devices, MEMS and miniature electronic parts.

Applicable product: Twin-air

Dispensing machines for wafers